Plasma Dicing Enables Challenging Applications Including D2W Hybrid Bonding
According to Richard Barnett of SPTS/KLA, as semiconductor content proliferates across networks and devices, there’s a growing demand for increased semiconductor functionality packed into smaller, thinner, and stronger packages. Plasma dicing offers an optimized approach to die singulation as chips get smaller, thinner, and more complex and this challenge invites a fresh look at die singulation methods.