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Packaging innovation drives inspection requirements for automotive apps and more
The chip packaging challenges that emerged in the development of segments like mobile and high-performance computing (HPC) were complex, but the solutions developed so far are proving to be valuable to the evolution of chip packaging for the automotive domain as well—and this is no coincidence, according to KLA.
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Plasma Dicing Enables Challenging Applications Including D2W Hybrid Bonding
According to Richard Barnett of SPTS/KLA, as semiconductor content proliferates across networks and devices, there’s a growing demand for increased semiconductor functionality packed into smaller, thinner, and stronger packages. Plasma dicing offers an optimized approach to die singulation as chips get smaller, thinner, and more complex and this challenge invites a fresh look at die singulation methods.
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KLA Advance Blog: New KLA Manufacturing Plant in South Korea Drives Innovation in Flat Panel Displays
As flat panel display (FPD) technologies continue to advance, KLA unveiled its first manufacturing facility in South Korea to better serve strategic customers in the Asia-Pacific region. The new plant in Cheonan, Chungcheongnam-do will align the production of KLA’s automated optical inspection (AOI) systems with South Korea’s premier FPD fabricators’ immediate needs for high-speed, high-precision inspection solutions that enhance yield and reduce waste.
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KLA Advance Blog: KLA Celebrates the 75th Anniversary of the Transistor
Semiconductors chips – the heart of our modern electronic devices – are built atop a technology first introduced 75 years ago today: the transistor. In concert with our peers throughout the technology industry – including IEEE and the Electron Devices Society – KLA celebrates the innovation of John Bardeen and Walter Brattain whose lab demonstration of a point-contact transistor on Dec. 16, 1947, changed the course of modern electronics.
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KLA Advance Blog: New Orbotech Corus Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized resolution, accuracy and efficiency for PCB manufacturers designing smaller, thinner devices for OEMs that pack ever-increasing functionality into increasingly small enclosures for high-end applications.
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KLA Advance Blog: Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
KLA’s new ICOS™ F260 system addresses zero tolerance by delivering inspection and workflow enhancements on a platform that’s been redesigned from the ground up to deliver industry-leading accuracy and greater overall throughput to support high-volume manufacturing. The ICOS F260 offers the fully automated ability to detect both internal and superficial chip defects with extremely low overkill and underkill rates to help optimize yield.
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KLA Advance Blog: KLA’s Frontline Cloud Services Sharply Reduces DFM Analysis Time
Frontline Cloud Services improves the DFM process with the cloud delivering almost infinite computational power on demand, which helps companies analyze more DFM checklists both serially and in parallel.
