KLA Advance Blog: New Orbotech Corus Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized resolution, accuracy and efficiency for PCB manufacturers designing smaller, thinner devices for OEMs that pack ever-increasing functionality into increasingly small enclosures for high-end applications.
