Read Coverage
KLA Advance Blog: New Orbotech Corus Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized resolution, accuracy and efficiency for PCB manufacturers designing smaller, thinner devices for OEMs that pack ever-increasing functionality into increasingly small enclosures for high-end applications.
Read Coverage
KLA Advance Blog: Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
KLA’s new ICOS™ F260 system addresses zero tolerance by delivering inspection and workflow enhancements on a platform that’s been redesigned from the ground up to deliver industry-leading accuracy and greater overall throughput to support high-volume manufacturing. The ICOS F260 offers the fully automated ability to detect both internal and superficial chip defects with extremely low overkill and underkill rates to help optimize yield.
Read Coverage
Move ICs from defects per million to defects per billion
Defective Parts Per Million (DPPM) is one of the key metrics used to measure quality in many semiconductor segments. With electronics becoming more and more a part of everyday life (wearable electronics and semi-autonomous vehicles), there's increasing pressure to improve quality across all semiconductor market segments. For mission-critical segments such as automotive and medical, market forces are driving improvements in quality into the Defective Parts Per Billion (DPPB) range.
