Read Coverage
Creating A Greener Future In Photovoltaic Manufacturing
In a Forbes Business Council post, NexWafe CEO Davor Sutija shares transformative insights on revolutionizing photovoltaic manufacturing. Key highlights include policy-driven growth, tackling carbon debt, setting new standards and making informed choices.
Read Coverage
Packaging innovation drives inspection requirements for automotive apps and more
The chip packaging challenges that emerged in the development of segments like mobile and high-performance computing (HPC) were complex, but the solutions developed so far are proving to be valuable to the evolution of chip packaging for the automotive domain as well—and this is no coincidence, according to KLA.
Read Coverage
Plasma Dicing Enables Challenging Applications Including D2W Hybrid Bonding
According to Richard Barnett of SPTS/KLA, as semiconductor content proliferates across networks and devices, there’s a growing demand for increased semiconductor functionality packed into smaller, thinner, and stronger packages. Plasma dicing offers an optimized approach to die singulation as chips get smaller, thinner, and more complex and this challenge invites a fresh look at die singulation methods.
Read Coverage
KLA Advance Blog: New KLA Manufacturing Plant in South Korea Drives Innovation in Flat Panel Displays
As flat panel display (FPD) technologies continue to advance, KLA unveiled its first manufacturing facility in South Korea to better serve strategic customers in the Asia-Pacific region. The new plant in Cheonan, Chungcheongnam-do will align the production of KLA’s automated optical inspection (AOI) systems with South Korea’s premier FPD fabricators’ immediate needs for high-speed, high-precision inspection solutions that enhance yield and reduce waste.
Read Coverage
KLA Advance Blog: KLA Celebrates the 75th Anniversary of the Transistor
Semiconductors chips – the heart of our modern electronic devices – are built atop a technology first introduced 75 years ago today: the transistor. In concert with our peers throughout the technology industry – including IEEE and the Electron Devices Society – KLA celebrates the innovation of John Bardeen and Walter Brattain whose lab demonstration of a point-contact transistor on Dec. 16, 1947, changed the course of modern electronics.
Read Coverage
KLA Advance Blog: New Orbotech Corus Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized resolution, accuracy and efficiency for PCB manufacturers designing smaller, thinner devices for OEMs that pack ever-increasing functionality into increasingly small enclosures for high-end applications.
Read Coverage
KLA Advance Blog: Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
KLA’s new ICOS™ F260 system addresses zero tolerance by delivering inspection and workflow enhancements on a platform that’s been redesigned from the ground up to deliver industry-leading accuracy and greater overall throughput to support high-volume manufacturing. The ICOS F260 offers the fully automated ability to detect both internal and superficial chip defects with extremely low overkill and underkill rates to help optimize yield.
Read Coverage
Read Coverage
KLA Advance Blog: KLA’s Frontline Cloud Services Sharply Reduces DFM Analysis Time
Frontline Cloud Services improves the DFM process with the cloud delivering almost infinite computational power on demand, which helps companies analyze more DFM checklists both serially and in parallel.
Read Coverage
Manufacturing advances solve free-form display design challenges
Orbotech FPD experts discuss leveraging new manufacturing inspection and testing advances that enable designers to include features, such as cameras and sensors, in free-form display designs.
Read Coverage
On a roll: New manufacturing processes inspired by flex
Meny Gantz of Orbotech discusses how the market demand for highly innovative circuits has roll-to-roll (R2R) manufacturing emerging as a truly effective means for printing FPCs in high volumes, with minimum handling damage, with high yield, and at high speeds.
Read Coverage
Industry 4.0 Drives New Perspective on PCB Manufacturing
“PCB users and AI systems want to know everything they can about every PCB coming off the production line. New advanced traceability techniques associated with process control and visualization capabilities can tell them a lot."
Read Coverage
PCB factories embrace AI
The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect PCBs, IC substrates and more, has been matched by manufacturing processes that have evolved from manual assembly to highly automated production. As manufacturing technology further develops, processes become more complex and more sophisticated, including the ability to inspect and then shape defects that would once have resulted in scrapped panels. A significant opportunity is now emerging for the PCB manufacturing industry to capitalize on artificial intelligence (AI) and optimize production processes and, ultimately, the entire PCB manufacturing facility.
