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KLA Advance Blog: KLA Celebrates the 75th Anniversary of the Transistor
Semiconductors chips – the heart of our modern electronic devices – are built atop a technology first introduced 75 years ago today: the transistor. In concert with our peers throughout the technology industry – including IEEE and the Electron Devices Society – KLA celebrates the innovation of John Bardeen and Walter Brattain whose lab demonstration of a point-contact transistor on Dec. 16, 1947, changed the course of modern electronics.
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KLA Advance Blog: New Orbotech Corus Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
The new Orbotech Corus 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized resolution, accuracy and efficiency for PCB manufacturers designing smaller, thinner devices for OEMs that pack ever-increasing functionality into increasingly small enclosures for high-end applications.
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KLA Advance Blog: Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
KLA’s new ICOS™ F260 system addresses zero tolerance by delivering inspection and workflow enhancements on a platform that’s been redesigned from the ground up to deliver industry-leading accuracy and greater overall throughput to support high-volume manufacturing. The ICOS F260 offers the fully automated ability to detect both internal and superficial chip defects with extremely low overkill and underkill rates to help optimize yield.
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KLA Advance Blog: KLA’s Frontline Cloud Services Sharply Reduces DFM Analysis Time
Frontline Cloud Services improves the DFM process with the cloud delivering almost infinite computational power on demand, which helps companies analyze more DFM checklists both serially and in parallel.
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Manufacturing advances solve free-form display design challenges
Orbotech FPD experts discuss leveraging new manufacturing inspection and testing advances that enable designers to include features, such as cameras and sensors, in free-form display designs.
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On a roll: New manufacturing processes inspired by flex
Meny Gantz of Orbotech discusses how the market demand for highly innovative circuits has roll-to-roll (R2R) manufacturing emerging as a truly effective means for printing FPCs in high volumes, with minimum handling damage, with high yield, and at high speeds.
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Industry 4.0 Drives New Perspective on PCB Manufacturing
“PCB users and AI systems want to know everything they can about every PCB coming off the production line. New advanced traceability techniques associated with process control and visualization capabilities can tell them a lot."
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PCB factories embrace AI
The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect PCBs, IC substrates and more, has been matched by manufacturing processes that have evolved from manual assembly to highly automated production. As manufacturing technology further develops, processes become more complex and more sophisticated, including the ability to inspect and then shape defects that would once have resulted in scrapped panels. A significant opportunity is now emerging for the PCB manufacturing industry to capitalize on artificial intelligence (AI) and optimize production processes and, ultimately, the entire PCB manufacturing facility.
