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Storage Newsletter: Everspin with Partner Cobham Advanced Electronic Solutions Developed Toggle MRAM for Space Applications

Everspin with Partner Cobham Advanced Electronic Solutions Developed Toggle MRAM for Space Applications

Everspin Technologies, Inc.‘s partner Cobham Advanced Electronic Solutions (CAES) presented a technical case study describing the versatility and performance of their jointly developed Toggle MRAM for space applications.

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DigiTimes: Everspin and GF MRAM development expanded to 12nm

Everspin and GF MRAM development expanded to 12nm

Magnetoresistive memory (MRAM) giant Everspin announced the revision of the STT-MRAM joint development agreement with GlobalFoundries.

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Electronic Design: Catching Up on the Latest Developments in MRAM

Catching Up on the Latest Developments in MRAM

Electronic Design’s Bill Wong discusses MRAM, a future universal memory, with Everspin President and CEO Kevin Conley.

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AnandTech: GlobalFoundries & Everspin Extend MRAM Pact to 12nm

Magnetic RAM Finds Its Niche

Everspin stakes out the territory for magnetic nonvolatile memories.

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Electronic Engineering Journal: Magnetic RAM Finds Its Niche

Magnetic RAM Finds Its Niche

Everspin stakes out the territory for magnetic nonvolatile memories.

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CDRinfo: STT-MRAM Coming to Industrial and IoT Applications

STT-MRAM Coming to Industrial and IoT Applications

Everspin Technologies, Inc., is developing STT-MRAM specifically for Industrial. and IoT applications.

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EDA Cafe: Everspin Releases Design Guide for using 1 Gb STT-MRAM with Xilinx DDR4 FPGA Controller

Everspin Releases Design Guide for using 1 Gb STT-MRAM with Xilinx DDR4 FPGA Controller

Xilinx, Inc., the leader in adaptive and intelligent computing, has been supporting Everspin’s STT-MRAM for two generations and enables the 1 Gb STT-MRAM solution using its DDR4 controller in the Xilinx Vivado development environment.

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ZDNet: The 3 biggest storage trends of the next decade

The 3 biggest storage trends of the next decade

I've been watching storage for some 40 years. And each decade has seen accelerating change, and none more so than the the past 10 years. That trend will continue. Here's the biggest trends I expect to affect all who use storage, whether they know it or not.

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VentureBeat: 3 emerging memory technologies that will change how you handle data

3 emerging memory technologies that will change how you handle data

A couple of years back, IDC predicted that by 2025 the average person will interact with connected devices 4,800 times per day. Information pouring in from those sensors will fuel machine learning, language processing, and artificial intelligence, all requiring fast storage and more compute horsepower. The next generation of memory technologies will address gaps in today’s storage hierarchy, delivering data where it’s needed for real-time processing. MRAM shows promise at the edge.

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TheNextPlatform: When Persistence is a Virtue, MRAM is an Alternative to DRAM and SRAM

When Persistence is a Virtue, MRAM is an Alternative to DRAM and SRAM

Magneto-resistive random access memory (MRAM) is one of those technologies that is often talked about as having the potential to change the computer memory landscape. But in actuality, MRAM has been commercially available since 2006 and is already displacing static RAM (SRAM), dynamic RAM (DRAM), and flash NAND in number of applications inside and outside the datacenter.

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Electronic Design: Could 3D Printing Disrupt the Electronics Industry?

Could 3D Printing Disrupt the Electronics Industry?

More companies and universities are integrating 3D printing with their electronic design. The non-traditional process was well-received as it moved from the aerospace to automotive to medical industries. Electronics could be next on the list to benefit from 3D printing, according to Ernst and Young. Today, many people say we will never 3D-print phones and other complex, multi-material products. However, with so many companies pushing to develop a magical all-encompassing printer, will we see electronics being manufactured with 3D printing?

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3D Print: 3D Printing Spotlight On: Hila Elimelech, Vice President of Materials, Nano Dimension

3D Printing Spotlight On: Hila Elimelech, Vice President of Materials, Nano Dimension

Israel-based Nano Dimension is seeking to change the way things are made, with their flagship DragonFly 2020 3D printer catching attention from many quarters for its ability to 3D print electronics including printed circuit boards (PCBs).

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TCT Magazine: PHYTEC enjoys reduction in time and cost with Nano Dimension DragonFly 2020 3D printer

PHYTEC enjoys reduction in time and cost with Nano Dimension DragonFly 2020 3D printer

In November 2016, Nano Dimension Technologies delivered a beta DragonFly 2020 to its third customer: PHYTEC, a German microprocessor solutions provider. The deal came about as PHYTEC tackled an increasing demand for prototypes from its customer base. PHYTEC needed a solution which could reduce development time, while maintaining the quality of its products and service. It decided to take on Nano Dimension’s flagship 3D printing technology, and today is publishing the results.

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Tom's Hardware: Phison Brings Everspin’s 1Gb STT-MRAM To Next-Gen SSD Controllers

Phison Brings Everspin’s 1Gb STT-MRAM To Next-Gen SSD Controllers

The technology that never goes mainstream even after 30 years of advancement is advancing even farther into the enterprise market, thanks to a partnership that pairs Everspin's latest 1Gb ICs with Phison’s next-gen SSD controller.

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EENews Europe: Lights-out digital manufacturing delivers first 3D printed electronics

Lights-out digital manufacturing delivers first 3D printed electronics

Additive electronics provider Nano Dimension Ltd. has unveiled its new DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, which the company presents as the industry’s only comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuitry. The initial deployment took place at the Munich premises of sensor and defense electronics provider Hensoldt.

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Design World: Nano Dimension introduced low-volume, continuous additive manufacturing system for electronics production

Nano Dimension introduced low-volume, continuous additive manufacturing system for electronics production

Additively manufacturing functional circuits round-the-clock with little or no operator intervention is possible with the new DragonFly LDM precision additive manufacturing system from Nano Dimension. This 3D printer will build electronic components such as multilayer Printed Circuit Boards (PCBs), antennas, sensors and so on, round-the-clock, enabling Nano Dimension to shift from developing prototyping printers to systems that handle one-off prototypes as well as low-volume manufacturing of printed electronics. 

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3D Printing Industry: Nano Dimension CEO Amit Dror on the launch of the 24 hour DragonFly LDM 3D printer

INTERVIEW: Nano Dimension CEO Amit Dror on the launch of the 24 hour DragonFly LDM 3D printer

Designed for 24 hour electronics production, the DragonFly LDM (standing for Lights-Out Digital Manufacturing) is a new 3D printer and DragonFly Pro upgrade from Israeli 3D printed electronics company Nano Dimension. Hinted at in a corporate update earlier this month, the machine was launched today through the company’s global sales channel and requires minimal operator intervention, representing a significant advance for 3D printed electronics.

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AnandTech: Everspin Begins Production of 1 Gb STT-MRAM

Everspin Begins Production of 1 Gb STT-MRAM

Everspin recently announced they have begun pilot production of their 1Gb STT-MRAM (Spin-transfer Torque Magnetoresistive RAM) nonvolatile memory, after shipping the first pre-production samples in December. The new MRAM parts are fabbed on a GlobalFoundries 28nm process and are a significant advance in density and capacity compared to their current 40nm 256Mb parts. Production will be ramping up through the second half of this year.

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Lowell Sun: MACOM expanding in Lowell

MACOM Expanding in Lowell

MACOM, the city's largest advanced manufacturing company, symbolically broke ground Wednesday on a new, 50,000 square-foot facility that will be able to support as many as 150 new jobs in a booming industry.

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EBN: Cross-Organizational Data Sharing in the Auto Supply Chain Reduces Defects

Cross-Organizational Data Sharing in the Auto Supply Chain Reduces Defects

For years, semiconductor manufacturers have leveraged manufacturing data throughout their globally-dispersed supply chains to improve quality and reduce return material authorizations (RMAs). Automotive OEMs and Tier 1 suppliers are now working to meet the similar challenge of reducing defective parts per million (DPPM) and beyond in vehicle production. The ability to share and connect data backwards and forwards throughout the supply chain is now seen as a key capability to address this challenge. How can sharing data throughout the automotive supply chain reduce DPPM?

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EDN: Move ICs from defects per million to defects per billion

Move ICs from defects per million to defects per billion

Defective Parts Per Million (DPPM) is one of the key metrics used to measure quality in many semiconductor segments. With electronics becoming more and more a part of everyday life (wearable electronics and semi-autonomous vehicles), there's increasing pressure to improve quality across all semiconductor market segments. For mission-critical segments such as automotive and medical, market forces are driving improvements in quality into the Defective Parts Per Billion (DPPB) range.

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Evaluation Engineering: Real-time adaptive test algorithm can safely reduce wafer testing time and cost

Real-time adaptive test algorithm can safely reduce wafer testing time and cost

The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both a plant’s production throughput and production costs.