Phison Brings Everspin’s 1Gb STT-MRAM To Next-Gen SSD Controllers
The technology that never goes mainstream even after 30 years of advancement is advancing even farther into the enterprise market, thanks to a partnership that pairs Everspin's latest 1Gb ICs with Phison’s next-gen SSD controller.
Lights-out digital manufacturing delivers first 3D printed electronics
Additive electronics provider Nano Dimension Ltd. has unveiled its new DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, which the company presents as the industry’s only comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuitry. The initial deployment took place at the Munich premises of sensor and defense electronics provider Hensoldt.
Nano Dimension introduced low-volume, continuous additive manufacturing system for electronics production
Additively manufacturing functional circuits round-the-clock with little or no operator intervention is possible with the new DragonFly LDM precision additive manufacturing system from Nano Dimension. This 3D printer will build electronic components such as multilayer Printed Circuit Boards (PCBs), antennas, sensors and so on, round-the-clock, enabling Nano Dimension to shift from developing prototyping printers to systems that handle one-off prototypes as well as low-volume manufacturing of printed electronics.
INTERVIEW: Nano Dimension CEO Amit Dror on the launch of the 24 hour DragonFly LDM 3D printer
Designed for 24 hour electronics production, the DragonFly LDM (standing for Lights-Out Digital Manufacturing) is a new 3D printer and DragonFly Pro upgrade from Israeli 3D printed electronics company Nano Dimension. Hinted at in a corporate update earlier this month, the machine was launched today through the company’s global sales channel and requires minimal operator intervention, representing a significant advance for 3D printed electronics.
Everspin Begins Production of 1 Gb STT-MRAM
Everspin recently announced they have begun pilot production of their 1Gb STT-MRAM (Spin-transfer Torque Magnetoresistive RAM) nonvolatile memory, after shipping the first pre-production samples in December. The new MRAM parts are fabbed on a GlobalFoundries 28nm process and are a significant advance in density and capacity compared to their current 40nm 256Mb parts. Production will be ramping up through the second half of this year.
Cross-Organizational Data Sharing in the Auto Supply Chain Reduces Defects
For years, semiconductor manufacturers have leveraged manufacturing data throughout their globally-dispersed supply chains to improve quality and reduce return material authorizations (RMAs). Automotive OEMs and Tier 1 suppliers are now working to meet the similar challenge of reducing defective parts per million (DPPM) and beyond in vehicle production. The ability to share and connect data backwards and forwards throughout the supply chain is now seen as a key capability to address this challenge. How can sharing data throughout the automotive supply chain reduce DPPM?
Move ICs from defects per million to defects per billion
Defective Parts Per Million (DPPM) is one of the key metrics used to measure quality in many semiconductor segments. With electronics becoming more and more a part of everyday life (wearable electronics and semi-autonomous vehicles), there's increasing pressure to improve quality across all semiconductor market segments. For mission-critical segments such as automotive and medical, market forces are driving improvements in quality into the Defective Parts Per Billion (DPPB) range.
Real-time adaptive test algorithm can safely reduce wafer testing time and cost
The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both a plant’s production throughput and production costs.